Samsung Exynos 2400 first to use FOWLP tech for improved thermal management
Samsung introduced the Exynos 2400 Deca-Core processor this week that powers the Galaxy S24 and the S24+ smartphones in India and European countries. The company said that Exynos 2400 the first Exynos processor to use a Fan-out Wafer Level Package (FOWLP) to boost thermal management.
The Fan-out Wafer Level Package (FOWLP) makes more space for I/O connections, allowing electric signals to move quickly and efficiently. Samsng said that Exynos 2400 has made major improvements in heat management by developing packaging with lower heat resistance, while enabling a small form factor, so the device stays cooler even during long app use and intense gaming sessions.
FOWLP offers a 23% bump in heat resistance when running on a single-core and an 8% improvement for multi-core, compared to flip-chip package, and provide up to a 40% smaller form factor, and up to a 30% thickness reduction by eliminating the substrate.
Based on reports, the Samsung Galaxy S24 Plus powered by Exynos 2400 offers better performance in 3D Mark Solar Bay Stress compared to Samsung Galaxy S24 Ultra powered by Snapdragon 8 Gen 3 for Galaxy. We will have to verify this once we get the hands on both the phones.
Other reports say that the hexa-core Samsung Xclipse 940 GPU in the Exynos 2400 offers the highest score of 4231 in the 3D Mark Wildlife extreme test on par with Apple A17 Pro, and 2x better than the Exynos 2200 which was used in the Galaxy S22 in countries.
Credit:fonearena
