A new rumor claims that Samsung plans to make an important change to how it's chipsets are put together in order to make the Exynos 2400 better.
Rumor has it that Samsung is planning to utilize FoWLP (Fan-out Wafer Level Packaging) for the Exynos 2400. FoWLP refers to the method utilized for enclosing all of the integrated circuits. The package also protects the die and connects the chipset to the motherboard.
FoWLP delivers a higher integration level in a smaller package footprint. The input/out I/O is also higher with significantly improved thermal and electrical performance. In simple words, this means that if FoWLP is utilized to make the Exynos 2400, the chipset will be smaller yet more powerful as well as more power efficient, at least in theory.
This should help the Exynos 2400 be at par with the superior optimization and power efficiency of it's Snapdragon counterparts. Samsung could squeeze further optimization through the other components and it's software to deliver a significantly better Exynos-powered variant.
